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Down light,
Thermal conductivity: 1.5W/M-K
Board Thickness: 1.6MM
Copper Thickness: 35UM
Base Material: Aluminum
Surface Finishing: Lead-free HASL
Solder mask color: white
(Hole Size) |
(Drilling hole size) |
0.6-6.0 mm |
(FG hole size) |
0.6-6.0 mm |
|
(Hole tolerance) |
±0.075 mm |
|
(Tolerance of hole position) |
±0.1mm |
|
(Aspect ratio) |
5:01 |
|
(Solder) |
(Min solder bridge) |
4 mil |
(Dimension) |
(Tolerance of outline dimension) |
(Length): 1200mm |
(Max board size) |
(Width): 300mm |
|
(Impedance) |
(Impedance tolerance) |
±10% |
(Heat conductivity) |
(Low heat conductivity) |
1.0-1.5W/m*k |
(Wid heat conductivity) |
1.5-1.8W/m*k |
|
(High heat conductivity) |
2.0-3.0W/m*k |
|
(Peel strength) |
≥1.8 N/mm |
|
(Surface resistance) |
≥1*105m |
|
(Volume resistrivity) |
≥1*106m |
|
(Breakdown voltage) |
≥2KV/mm |
|
(The solder resistance) |
(260℃,10min,no delamination no blister) |
|
(Dielectric constant) |
≤ 4.4 |
|
(Dielectric power factor) |
≤0.03 |
|